Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Author:

Wei TiweiORCID,Oprins HermanORCID,Cherman Vladimir,Yang Zhi,Rivera Kathryn C.,Plas Geert Van derORCID,Pawlak Bartlomiej J.,England Luke,Beyne Eric,Baelmans Martine

Funder

imec Industrial Affiliation Program on 3-D System Integration

imec partners and the imec Reliability, Electrical Testing, Modeling and 3-D Technology teams

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal Mitigation Strategy for Backside Power Delivery Network;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement;Fluids;2024-03-07

3. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

4. Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC);2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

5. Atomistic insights into the microscope mechanism of solid–liquid interaction influencing convective heat transfer of nanochannel;Journal of Molecular Liquids;2023-02

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