Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study-Reference-Cited by-同舟云学术

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Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Oprins H.¹,Wei Tiwei¹,Cherman Vladimir¹,Beyne E.¹

Affiliation:

1. imec,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177551.pdf?arnumber=10177551

Reference15 articles.

1. Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

2. 3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding

3. Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

4. Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

2. Thermal Mitigation Strategy for Backside Power Delivery Network;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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