Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8747321/8756497/08757402.pdf?arnumber=8757402
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Direct Phase-Change Cooling of Vapor Chamber Integrated With IGBT Power Electronic Module for Automotive Application;IEEE Transactions on Power Electronics;2021-05
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