Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems-Reference-Cited by-同舟云学术

Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Kim Taehwan¹,Lee Jonggyu¹,Kim Jaechoon¹,Lee Eung-Chang²,Hwang Heejung¹,Kim Youngdeuk¹,Oh Dan Kyung Suk¹

Affiliation:

1. Package Design Team, Samsung Electronics Co., Ltd.,Hwaseong-si,South Korea

2. DRAM Memory Planning, Samsung Electronics Co., Ltd.,Hwaseong-si,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899586.pdf?arnumber=9899586

Reference8 articles.

1. Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

2. Recent Advances and Trends in Heterogeneous Integrations

3. Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages

4. Design Considerations, Demonstratio, and Benchmarking of Silicon Microcold Plate and Monolithic Microfluidic Cooling for 2.5D ICs;sreejith;IEEE 71st ECTC,2021

5. Effective thermal conductivity of composites

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