Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)-Reference-Cited by-同舟云学术

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Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)

Published:2023-04-17 Issue: Volume: Page:
ISSN:
Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Moloudi Reza¹,Grün Tobias²,Verleysen Willem³,Vandevelde Bart¹,Cleuren Silke G.C.³,May Daniel²,Wunderle Bernhard²

Affiliation:

1. IMEC,Leuven,Belgium

2. TU Chemnitz,Germany

3. Materialise,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100758.pdf?arnumber=10100758

Reference11 articles.

1. Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

2. Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

3. Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns

4. Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

5. Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

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