Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip-Reference-Cited by-同舟云学术

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

Published:2019-04 Issue: Volume:152 Page:308-318
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Wei T.-W.,Oprins H.,Cherman V.,Van der Plas G.,De Wolf I.,Beyne E.,Baelmans M.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference34 articles.

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4. Direct liquid cooling of bare die packages using a microchannel cold plate;Acikalin,2014

5. Spatial temperature resolution in single-phase micro slot jet impingement cooling;Vutha;Int. J. Heat Mass Transf.,2018

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