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Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

  • Published:2020-04 Issue:4 Volume:10 Page:577-589
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wei TiweiORCID,Oprins HermanORCID,Cherman Vladimir,Beyne Eric,Baelmans Martine

Funder

imec Industrial Affiliation Program on 3D System Integration

imec partners and the imec Reliability, Electrical Testing, Modeling and 3D Technology Teams

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A novel microchannel-twisted pinfin hybrid heat sink for hotspot mitigation;Applied Thermal Engineering;2024-03

2. Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap;Applied Thermal Engineering;2024-03

3. Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06

4. Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV);2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Maximizing Energy Efficiency in Additive Manufacturing: A Review and Framework for Future Research;Energies;2023-05-18
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