Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture-Reference-Cited by-同舟云学术

Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture

Published:2023-04 Issue:4 Volume:13 Page:560-569
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lee Chang-Chun¹^ORCID,Chang Che-Pei¹,Chen Chin-Yi¹,Lee Hung-Chih²,Chen Gary Chang-Fu²^ORCID

Affiliation:

1. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan

2. Unimicron Technology Corporation, Taoyuan, Taiwan

Funder

Ministry of Science and Technology (MOST), Taiwan

National Tsing Hua University Competitive Research Team

Ministry of Education’s Higher Education Sprout Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference35 articles.

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