Crack Resistance Evaluation Method of Photoimageable Dielectrics for Redistribution Layer-Reference-Cited by-同舟云学术

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Crack Resistance Evaluation Method of Photoimageable Dielectrics for Redistribution Layer

Published:2024-06-25 Issue:3 Volume:37 Page:341-344
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Takeuchi Kenichi¹,Koga Chiharu²,Shibata Tomoaki²,Aoki Yu²,Aoki Yukika¹

Affiliation:

1. Research and Development Center, Resonac Corporation

2. Packaging Solution Center, Resonac Corporation

Publisher

Technical Association of Photopolymers, Japan

Link

https://www.jstage.jst.go.jp/article/photopolymer/37/3/37_341/_pdf

Reference12 articles.

1. 1. M. Brunnbauer, E. Fürgut, G. Beer, and T. Meyer, 2006 8th Electronics Packaging Technology Conference (EPTC), 2006, p.1.

2. 2. C.-C. Lee, C.-P. Chang, and P.-C. Huang, IEEE Trans. Compon. Packaging Manuf. Technol., 13 (2023) 2016.

3. 3. W. Chen, J. Jiang, A. H. Meda, M. S. Ibrahim, G. Zhang, J. Fan, IEEE Trans. Electron Dev., 70 (2023) 2268.

4. 4. C.-C. Lee, C.-P. Chang, C.-Y. Chen, H.-C. Lee, and C.-F. Chen, IEEE Trans. Compon. Packag. Manuf. Technol., 13 (2023) 560.

5. 5. K. H. Kuo, D. Tai, S. Peng, and F. L. Chien, 2023 Proceedings 73rd Electronic Components and Technology Conference (ECTC), 2023, p.253.

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