Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package
Author:
Affiliation:
1. School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Science
2. System Packaging and Integration Technology Center, Institute of Microelectronics of Chinese Academy of Sciences
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/19/14/19_19.20220122/_pdf
Reference30 articles.
1. [1] Y.P. Zhang and D. Liu: “Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications,” IEEE Trans. Antennas Propag. 57 (2009) 2830 (DOI: 10.1109/TAP.2009.2029295).
2. [2] M. Alibakhshikenari, et al.: “High-gain on-chip antenna design on silicon layer with aperture excitation for terahertz applications,” IEEE Antennas Wireless Propag. Lett. 19 (2020) 1576 (DOI: 10.1109/LAWP.2020.3010865).
3. [3] S.N. Nallandhigal, et al.: “Deep integration and topological cohabitation of active circuits and antennas for power amplification and radiation in standard CMOS,” IEEE Trans. Microw. Theory Techn. 68 (2020) 4405 (DOI: 10.1109/TMTT.2020.2997049).
4. [4] M. Nafe, et al.: “Gain enhanced on-chip folded dipole antenna utilizing artificial magnetic conductor at 94GHz,” IEEE Antennas Wireless Propag. Lett. 16 (2017) 2844 (DOI: 10.1109/LAWP.2017.2749308).
5. [5] D.G. Kam, et al.: “LTCC packages with embedded phased-array antennas for 60GHz communications,” IEEE Microw. Wireless Compon. Lett. 21 (2011) 142 (DOI: 10.1109/LMWC.2010.2103932).
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