Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability-Reference-Cited by-同舟云学术

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

Published:2023-10 Issue:10 Volume:13 Page:1624-1641
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Kim Hakjun¹^ORCID,Hwang Jae Young¹^ORCID,Kim Sarah Eunkyung²^ORCID,Joo Young-Chang³^ORCID,Jang Hyejin³^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea

2. Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, South Korea

3. Research Institute of Advanced Materials (RIAM) and the Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea

Funder

National Research and Development Program through the National Research Foundation of Korea

Ministry of Science and Information and Communication Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10288291/10256204.pdf?arnumber=10256204

Reference110 articles.

1. Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies

2. Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages