Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability-Reference-Cited by-同舟云学术

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Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability

Published:2024-05-28 Issue: Volume: Page:643-646
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Lee Byoungdo¹,Choi Jinwoo¹,Lee Sangyong¹,Park Jinwoo¹,Kang Jihoon¹,Kwon Unoh¹,Lee Gyujei¹,Lee Kangwook¹

Affiliation:

1. SK Hynix Inc,Icheon,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565163.pdf?arnumber=10565163

Reference10 articles.

1. Foundry Perspectives on 2.5D/3D Integration and Roadmap

2. Heterogeneous Integration Using Organic Interposer Technology

3. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

4. Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages

5. Simulation of PWB warpage during fabrication and due to reflow

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