A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions-Reference-Cited by-同舟云学术

A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions

Published:2024-03-23 Issue:4 Volume:15 Page:428
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Zhou Shuai¹²,Ma Kaixue¹^ORCID,Wu Yugong¹,Wang Shizhao³^ORCID,Cai Nian⁴^ORCID

Affiliation:

1. School of Microelectronics, Tianjin University, Tianjin 300072, China

2. China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China

3. School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China

4. School of Information Engineering, Guangdong University of Technology, Guangzhou 510006, China

Abstract

Based on the theory of reliability enhancement testing technology, this study used a variety of testing combinations and finite element simulations to analyze the stress–strain properties of 3D packaging storage modules and then evaluated its operating and destruction limits during temperature cycling tests (−65 °C~+150 °C) for the purpose of identifying the weak points and failure mechanisms affecting its reliability. As a result of temperature cycling ultimate stress, 3D packaging storage devices can suffer from thermal fatigue failure in the case of abrupt temperature changes. The cracks caused by the accumulation of plastic and creep strains can be considered the main factors. Crack formation is accelerated by the CTE difference between the epoxy resin and solder joints. Moreover, the finite element simulation results were essentially the same as the testing results, with a deviation occurring within 10%.

Publisher

MDPI AG

Link

https://www.mdpi.com/2072-666X/15/4/428/pdf

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