A Via/Contact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization-Reference-Cited by-同舟云学术

A Via/Contact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization

Published:2022-10-21 Issue: Volume: Page:
ISSN:
Container-title:2022 International Workshop on Advanced Patterning Solutions (IWAPS)
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Author:

Zhou Hengyu¹,Zhang Tao¹,Li Sikun²,Tang Ming³,Xiong Shisheng⁴,Wang Xiangzhao¹

Affiliation:

1. Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences,Laboratory of information optics and Optoelectronics Technology,Shanghai,China

2. University of Chinese Academy of Science,Beijing,China

3. Huazhong University of Science and Technology,School of Optics and electronic information,Wuhan,China

4. Fudan University, Zhangjiang Laboratory,School of Information Science and Technology,Shanghai,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9971792/9972241/09972306.pdf?arnumber=9972306

Reference6 articles.

1. Design method and algorithms for directed self-assembly aware via layout decomposition in sub-7 nm circuits

2. Contact hole multiplication using graphoepitaxy directed self-assembly: process choices, template optimization, and placement accuracy;bekaert;Proc SPIE 9231,2014

3. Simultaneous template optimization and mask assignment for DSA with multiple patterning

4. Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias

5. Directed self-assembly of block copolymers for sub-10 nm fabrication[J];yu;Int J Extreme Manuf,2020

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