Design method and algorithms for directed self-assembly aware via layout decomposition in sub-7 nm circuits

Author:

Karageorgos Ioannis1,Ryckaert Julien2,Gronheid Roel2,Tung Maryann C.3,Wong H.-S. Philip3,Karageorgos Evangelos4,Croes Kris2,Bekaert Joost2,Vandenberghe Geert2,Stucchi Michele2,Dehaene Wim1

Affiliation:

1. imec, Kapeldreef 75, Leuven B-3001, BelgiumbKU Leuven, Department of Electrical Engineering (ESAT), Kasteelpark Arenberg 10, Leuven B-3001, Belgium

2. imec, Kapeldreef 75, Leuven B-3001, Belgium

3. Stanford University, Department of Electrical Engineering, 420 Via Palou, Stanford, California 94305, United States

4. University of Athens, Department of Informatics and Telecommunications, Panepistimiopolis, Athens 15784, Greece

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An Automatic Insertion Scheme of Extra Via for DSA-MP Hybrid Lithography;Proceedings of the Great Lakes Symposium on VLSI 2024;2024-06-12

2. Multiple patterning via layout decomposition method for directed self-assembly lithography;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-12-19

3. A Via/Contact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization;2022 International Workshop on Advanced Patterning Solutions (IWAPS);2022-10-21

4. A Generation solving Layout Decomposition Method for DSA-MP Hybrid Lithography;2022 International Workshop on Advanced Patterning Solutions (IWAPS);2022-10-21

5. Nanoscale phase change memory arrays patterned by block copolymer directed self-assembly;Novel Patterning Technologies 2022;2022-05-25

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