An Automatic Insertion Scheme of Extra Via for DSA-MP Hybrid Lithography-Reference-Cited by-同舟云学术

An Automatic Insertion Scheme of Extra Via for DSA-MP Hybrid Lithography

Published:2024-06-12 Issue: Volume:2017 Page:520-524
ISSN:
Container-title:Proceedings of the Great Lakes Symposium on VLSI 2024
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Author:

Wang Yuqin¹^ORCID,Guo Cheng²^ORCID,Su Xiaojing³^ORCID,Hong Xin³^ORCID,Liu Zixi⁴^ORCID,Ling Xiaohuan³^ORCID,Ma Bojie³^ORCID,Ren Pengyu³^ORCID,Jiang Yujie³^ORCID,Su Yajuan³^ORCID,Wei Yayi³^ORCID

Affiliation:

1. Institute of Microelectronics of the Chinese Academy of Sciences, University of Chinese Academy of Sciences, China

2. none, China

3. Institute of Microelectronics of the Chinese Academy of Sciences; University of Chinese Academy of Sciences, China

4. EDA Center, Institute of Microelectronics of the Chinese Academy of Sciences; University of Chinese Academy of Sciences, China

Funder

Youth Innovation Promotion Association Chinese Academy of Sciences

Beijing Institute of Electronics

National Natural Science Foundation of China

Strategic Priority Research Program of Chinese Academy of Sciences

Beijing Association for Science and Technology

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3649476.3658788

Reference15 articles.

1. International Roadmap for Devices and Systems lithography roadmap

2. Contact Hole Multiplication by Directed Self-Assembly of Block Copolymer with Homopolymer-Blending;Wu Zhiyong;IWAPS,2023

3. Kenji Yoshimoto and Takashi Taniguchi. 2013. Large-scale dynamics of directed self-assembly defects on chemically pre-patterned surface. Alternative Lithographic Technologies V.

4. Directed self-assembly graphoepitaxy template generation with immersion lithography

5. Yuansheng Ma 2017. Design technology co-optimization (DTCO) study on self-aligned-via (SAV) with Lamella DSA for sub-7 nm technology. Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480B (30 March 2017).