Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization
Author:
Affiliation:
1. Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Ingolstadt, Germany
2. L-LI-TCE, HELLA GmbH & Co. KGaA, Lippstadt, Germany
Funder
German Federal Ministry of Education and Reseach through the Project IQLED
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/7298/9789687/09716879.pdf?arnumber=9716879
Reference31 articles.
1. On thermal diffusivity
2. Junction–temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method
3. Development of high-efficiency and high-power vertical light emitting diodes
4. Development of a lead-free alloy for high-reliability, high-temperature applications;steen;Proc IPC APEX EXPO,2009
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