Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,300-75
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019517.pdf?arnumber=10019517
Reference11 articles.
1. Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications
2. Next Generation “Zen 3” Core
3. Multilayer RDL Interposer for Heterogeneous Device and Module Integration
4. Invited tutorial: Energy efficient multi-Gb/s I/O: Circuit and system design techniques
5. Organic Interposer CoWoS-R+ (plus) Technology
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4. Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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