Invited tutorial: Energy efficient multi-Gb/s I/O: Circuit and system design techniques
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5764912/5767267/05767268.pdf?arnumber=5767268
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A 0.297-pJ/Bit 50.4-Gb/s/Wire Inverter-Based Short-Reach Simultaneous Bi-Directional Transceiver for Die-to-Die Interface in 5-nm CMOS;IEEE Journal of Solid-State Circuits;2023-04
2. Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R);2022 International Electron Devices Meeting (IEDM);2022-12-03
3. Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-10
4. Embedded Multi-die Interconnect Bridge (EMIB);Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies;2019-04-19
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