Role of design factors for improving moisture performance of plastic packages-Reference-Cited by-同舟云学术

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Role of design factors for improving moisture performance of plastic packages

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Container-title:1992 Proceedings 42nd Electronic Components & Technology Conference
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Author:

Altimari S.,Golwalkar S.,Boysan P.,Foehringer R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/588/5242/00204319.pdf?arnumber=204319

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of dimple and metal coating on interfacial adhesion in plastic packages;Journal of Electronic Materials;2003-06

2. Microstructure, adhesion strength and failure path at a polymer/roughened metal interface;Journal of Adhesion Science and Technology;2003-01

3. New Adhesion Promoters for Copper Leadframes and Epoxy Resin;The Journal of Adhesion;2000-01

4. A novel high performance adhesion enhancing Zn-Cr leadframe coating for popcorn prevention;IEEE Transactions on Advanced Packaging;1999

5. The Correlation of Modelling with Measurements and Failure Modes;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999

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