1. Altimari, S., Golwarkar, S., Boynsan, P., and Foehringer, R. (1992). Role of design factors for improving performance of plastic packages. In Proc. 42
nd
IEEE Electronic Component & Technology Conference, pages 945–950.
2. Bittle, D. A., Suhling, J. C., Beaty, R. E., Jaeger, R. C., and Johnson, R. W. (1991). Piezoresistive stress sensors for structural analysis of electronic packages. Trans. ASME Journal of Electronic Packaging, 113(1):203–215.
3. Comizzoli, R. B., White, L. K., Kern, W., Schnable, G. L., Peters, D. A., Tracy, C. E., and Vibronek, R. D. (1980). Corrosion of aluminium IC metallization with defective surface passivation layer. In Proc. 18
th
IEEE International Reliability Physics Symposium, pages 282–292.
4. Edwards, D. R., Heinen, K. G., Groothius, S. K., and Martinez, J. E. (1987). Shear stress evaluation of plastic packages. IEEE Trans. Components Hybrids & Manufacturing Technology, 12(4):618–627.
5. Exposito, J. and Lamourelle, F. (1991). Report on the verification of the developed three dimensional model for stress simulation. Technical Report D1/2, SGS-Thomson Microelectronics, Avenue des Martyrs, BP20197 Grenoble, France. Prepared for ESPRIT II 5033 project PLASIC Performance and reliability of plastic encapsulated CMOS ASICs.