Effects of dimple and metal coating on interfacial adhesion in plastic packages-Reference-Cited by-同舟云学术

Effects of dimple and metal coating on interfacial adhesion in plastic packages

Published:2003-06 Issue:6 Volume:32 Page:564-573
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lebbai M.,Kim Jang-Kyo,Yuen Matthew M. F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0143-x.pdf

Reference22 articles.

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3. S. Kuroki and K. Oota, 39th Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1989), pp. 885–890.

4. N. Mogi and H. Yasuda, 42nd Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 1992), pp. 1023–1029.

5. S. Asai, U. Satura, and M. Tobita, J. Appl. Polym. Sci. 51, 1945 (1994).

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