Nano-structure Control of Leadframe Surface to Achieve Robust Juncture with Epoxy Resin-Reference-Cited by-同舟云学术

Nano-structure Control of Leadframe Surface to Achieve Robust Juncture with Epoxy Resin

Published:2015 Issue:4 Volume:135 Page:129-134
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Furuno Ryota¹²,Yamasaki Ryota¹,Kubo Kimihiko²,Haruyama Tetsuya¹

Affiliation:

1. Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology

2. Mitsui High-tec, Inc.

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/135/4/135_129/_pdf

Reference23 articles.

1. (1) R. Haruta : “Roadmap on Packaging Technology”, Journal of Japan Institute of Electronics Packaging, Vol. 10, No. 5, pp. 353-357 (2007) (in Japanese)

2. (2) R. Haruta : “Semiconductor Packages with Leadframe”, Journal of the Surface Finishing Society of Japan, Vol. 60, No. 4, pp. 255-231 (2009) (in Japanese)

3. (3) K. Kato : “General Information for Leadframe and its Surface Treatment Technology”, Journal of the Surface Finishing Society of Japan, Vol. 60, No. 4, pp. 218-224 (2009) (in Japanese)

4. (4) H. Miura : “Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis”, Journal of Japan Institute of Electronics Packaging, Vol. 10, No. 5, pp. 427-432 (2007) (in Japanese)

5. (5) K. Ohtsuka and T. Usami : “Science of electronic devices packaging”, Nikkei Business Publications, Inc., pp. 222-233 (1997) (in Japanese)

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules-Metal Composite Interface;Electronics and Communications in Japan;2016-12-13

2. Improve the Adhesive Strength of the Leadframe and Epoxy Resin by Forming of Organic Molecules-metal Composite Interface;IEEJ Transactions on Sensors and Micromachines;2016