Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules-Metal Composite Interface-Reference-Cited by-同舟云学术

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Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules-Metal Composite Interface

Published:2016-12-13 Issue:1 Volume:100 Page:67-71
ISSN:1942-9533
Container-title:Electronics and Communications in Japan
language:en
Short-container-title:Electron Comm Jpn

Author:

FURUNO RYOTA¹²,TAKATUJI YOSHIYUKI²,KUBO KIMIHIKO¹,HARUYAMA TETSUYA²

Affiliation:

1. Mitsui High-tec, Inc., Japan

2. Department of Life Science and Systems Engineering; Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, Japan

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy,Signal Processing

Reference14 articles.

1. Nano-structure control of leadframe surface to achieve robust juncture with epoxy resin;Furuno;IEEJ Trans SM,2015

2. General information for leadframe and its surface treatment technology;Kato;J Surf Finish Soc Jpn,2009

3. Semiconductor packages with leadframe;Haruta;J Surf Finish Soc Jpn,1988

4. Kitano M Nishimura A Kawai S Analysis of package cracking during reflow soldering process 90 95 1988

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation of Adhesion Promoter for Lead Frame Adhesion and Application to Epoxy Composite;ELASTOM COMPOS;2022

2. Study on Epoxy Resin Toughened by Epoxidized Hydroxy-Terminated Polybutadiene;Materials;2018-05-31

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