Author:
Müller Rainer,Heckmann Klaus,Habermann Manfred,Paul Thomas,Stratmann Martin
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Reference28 articles.
1. Fukuzawa, I., Ishiguro, S. and Nanbu, S. Proc. of IEEE Int. Reliability Phys. Symp. pp.192
2. Kitano, M., Nishimura, A. and Kawai, S. Proc. of IEEE Int. Reliability Phys. Symp. pp.20
3. Predicting delamination in plastic IC packages and determining suitable mold compound properties
4. Investigations of Large PLCC Package Cracking During Surface Mount Exposure
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