1. Substrate Design Optimization of Fine Pitch FCCSP for Molded Underfill Void Free Evaluation;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Characterization of encapsulant properties;Encapsulation Technologies for Electronic Applications;2019
3. Encapsulation process technology;Encapsulation Technologies for Electronic Applications;2019
4. Characterization of Dual Side Molding SiP Module;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
5. FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging;Applied Mechanics and Materials;2015-08