1. Standard Test Method for Spiral Flow of Low-Pressure Thermosetting Molding Compounds;ASTM D3123,1998
2. Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds;SEMI G11-88,1988
3. A new approach to capillary viscometry of thermoset transfer molding compounds;Blyler;Polym. Eng. Sci.,1986
4. The variation of glass transition as a function of the degree of cure in an epoxy-novolac system;Hale,1987
5. Epoxies Used in the Encapsulation of Integrated Circuits: Rheology, Glass Transition, and Reactive Processing;Hale,1988