1. Microelectronics Packaging Handbook, Semiconductor Packaging, Part II,1997
2. A semi-empirical algorithm for flow balancing in multi-cavity transfer molding;Manzione;Polym. Eng. Sci.,1989
3. Reactive flow simulation in transfer molding of IC packages;Nguyen,1993
4. Flow modeling of wire sweep during molding of integrated circuits;Nguyen,1992
5. A study of the effects of fillers on wire sweep related to semiconductor chip encapsulation;Han,1993