Author:
Belemjian P.M.,Erdogan O.,Kraft R.P.,McDonald J.F.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
8 articles.
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1. Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU;IEEE Access;2015
2. Design of BiCMOS SRAMs for high‐speed SiGe applications;IET Circuits, Devices & Systems;2014-11
3. Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology;IEEE Transactions on Circuits and Systems II: Express Briefs;2014-03
4. DA-MPM-Based Interconnection Architecture for the 3-D MP-SoC Design;2011 International Conference in Electrics, Communication and Automatic Control Proceedings;2011-11-12
5. Carry Chains for Ultra High-Speed SiGe HBT Adders;IEEE Transactions on Circuits and Systems I: Regular Papers;2011-09