InP / CMOS co-integration for energy efficient sub-THz communication systems
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9681915/9681831/09682092.pdf?arnumber=9682092
Reference10 articles.
1. A flexible power model for mm-wave and THz high-throughput communication systems
2. A 130 nm InP HBT integrated circuit technology for THz electronics
3. Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G;sun;Submitted ECTC,2022
4. High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer.
5. EPIC EU funded project,0
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5. RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz;2023 53rd European Microwave Conference (EuMC);2023-09-19
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