Parasitic effect analysis on TSV design factors
Author:
Affiliation:
1. Kangnam University,Electronic Package Research Center,Gyeonggi-do
Funder
Ministry of Trade, Industry & Energy(MOTIE, Korea)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013298.pdf?arnumber=10013298
Reference16 articles.
1. Accelerating Innovations in the New Era of HPC, 5G and Networking with Advanced 3D Packaging Technologies
2. Study on atomic migration of copper through-silicon-vias with Bosch scallops
3. Highly Processable wTSV Modular Manufacturing for Next Generation 3D MEMS/NEMS Integrated System
4. Thermo-Mechanical Design Rules for the Fabrication of TSV Interposers
5. Electrografted seed layers for metallization of deep TSV structures
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