Highly Processable wTSV Modular Manufacturing for Next Generation 3D MEMS/NEMS Integrated System-Reference-Cited by-同舟云学术

Highly Processable wTSV Modular Manufacturing for Next Generation 3D MEMS/NEMS Integrated System

Published:2022-06-20 Issue: Volume: Page:
ISSN:
Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
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Author:

Zhang Simian¹,Deng Xiaonan¹,Wang Yuqi¹,Wu Yifei¹,Ke Shengxian¹,Li Linsen²,Xing Chaoyang³,Li Zhengcao¹,Wang Chen¹

Affiliation:

1. School of Materials Science and Engineering, Tsinghua University,State Key Laboratory of New Ceramics and Fine Processing, Key Laboratory of Advanced Materials of Ministry of Education,Beijing,China,100084

2. The 43rd Research Institute of CETC,Anhui Province Key Laboratory of Microsystem,Hefei,Anhui,China,230088

3. Beijing Institute of Aerospace Control Devices,Beijing,100094

Funder

National Key R&D Program of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856850.pdf?arnumber=9856850

Reference18 articles.

1. Study of Vacuum-Assisted Spin Coating of Polymer Liner for High-Aspect-Ratio Through-Silicon-Via Applications

2. Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter

3. Refractory Plasmonics with Titanium Nitride: Broadband Metamaterial Absorber

4. Surface melting of Ni(110)

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