Effects of solder alloy compositions on microstructure and reliability of die-attach solder joints for automotive applications-Reference-Cited by-同舟云学术

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Effects of solder alloy compositions on microstructure and reliability of die-attach solder joints for automotive applications

Published:2015-12 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
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Author:

Liu Weiping,Lee Ning-Cheng,Bachorik Paul,LaBarbera Christine

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7395505/7412260/07412359.pdf?arnumber=7412359

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag Content in Harsh Environment;IEEE Transactions on Reliability;2023-12

2. Interconnect;Advanced Driver Assistance Systems and Autonomous Vehicles;2022

3. Cu3Sn-microporous copper composite joint for high-temperature die-attach applications;Soldering & Surface Mount Technology;2021-10-04

4. Lead-Free Soldering;Materials for Advanced Packaging;2016-11-19

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