Publisher
Springer International Publishing
Reference58 articles.
1. IPC global solder statistical program: results for Q4 2015 (2016)
2. Lee N-C (2016) Achieving high reliability of lead-free solder joints—materials consideration. In: ECTC, San Diego
3. Boyle R, Plant A, Vijay K. Low Ag SAC alloys. In: SMART group 30th conference
4. Syed A (2004) Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints. In: 54th ECTC, Las Vegas, 1–4 June 2004, pp 737–746
5. Wiese S, Roellig M, Wolter K-J (2005) Creep of eutectic SnAgCu in thermally treated solder joints. In: 55th ECTC, San Diego, 31 May–3 June 2005, pp 1272–1281
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