Creep of eutectic SnAgCu in thermally treated solder joints-Reference-Cited by-同舟云学术

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Creep of eutectic SnAgCu in thermally treated solder joints

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings Electronic Components and Technology, 2005. ECTC '05.
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Author:

Wiese S.,Roellig M.,Wolter K.-J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9844/31024/01441433.pdf?arnumber=1441433

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design for Reliability of Solder Joints;Assembly and Reliability of Lead-Free Solder Joints;2020

2. Solder Joint Characterization;Assembly and Reliability of Lead-Free Solder Joints;2020

3. Lead-Free Soldering;Materials for Advanced Packaging;2016-11-19

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