Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag Content in Harsh Environment
Author:
Affiliation:
1. Department of Electronic Engineering, Hanyang University, Seoul, South Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality
Link
http://xplorestaging.ieee.org/ielx7/24/10339143/10079934.pdf?arnumber=10079934
Reference31 articles.
1. Effects of solder alloy compositions on microstructure and reliability of die-attach solder joints for automotive applications
2. Investigating micro-alloyed solders with thermal shock tests
3. Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
4. Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates
5. Accelerated reliability test results: importance of input vibration spectrum and mechanical response of test article
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