Electrical Properties of Silicone Gel for WBG-Based Power Module Packaging at High Temperatures-Reference-Cited by-同舟云学术

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Electrical Properties of Silicone Gel for WBG-Based Power Module Packaging at High Temperatures

Published:2023-04 Issue:2 Volume:30 Page:852-861
ISSN:1070-9878
Container-title:IEEE Transactions on Dielectrics and Electrical Insulation
language:
Short-container-title:IEEE Trans. Dielect. Electr. Insul.

Author:

Zhang Boya¹^ORCID,Yang Ziyue¹,Li Kaixuan¹^ORCID,Jiang Xinyu¹,Li Xingwen¹^ORCID,Chang Guiqin²,Ghassemi Mona³^ORCID

Affiliation:

1. State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China

2. State Key Laboratory of Advanced Power Semiconductor Devices, Hunan, Zhuzhou, China

3. Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA

Funder

National Key Research and Development Program of China

Shaanxi Provincial Science and Technology Plan Project

Zhuzhou CRRC Times Electric Company Ltd

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/94/10089236/09982478.pdf?arnumber=9982478

Reference35 articles.

1. Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials

2. Tailoring Electric Field Distortion in High-Voltage Power Modules Utilizing Epoxy Resin/Silicon Carbide Whisker Composites with Field-Dependent Conductivity

3. Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions

4. Computation and analysis of dielectric losses in MV power electronic converter insulation

5. Enhanced field-dependent conductivity and material properties of nano-AlN/micro-SiC/silicone elastomer hybrid composites for electric stress mitigation in high-voltage power modules

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of high temperature and high humidity on the reliability of copper/epoxy bond;Applied Surface Science;2024-07

2. Electrical Trees in Silicone Gel Influenced by Different Frequency and Pulsewidth Under Unipolar High-Frequency Square Wave Voltage;IEEE Transactions on Dielectrics and Electrical Insulation;2024-06

3. Enhanced high‐temperature electrical properties and charge dynamics of inorganic/organic silicone elastomer nanocomposites via nanostructure grafting and molecular trap construction;Polymer Composites;2024-05-16

4. A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging;2024 IEEE Texas Power and Energy Conference (TPEC);2024-02-12

5. Characterizing Nonlinear Field Dependent Conductivity Layers to Mitigate Electric Field Within (U)WBG Power Modules Under High Frequency, High Slew Rate Square Voltage Pulses;2024 IEEE Texas Power and Energy Conference (TPEC);2024-02-12

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