Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions-Reference-Cited by-同舟云学术

Experimental and Finite Element Analysis of Epoxy-Based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions

Published:2022-01 Issue:1 Volume:12 Page:11-26
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wang Qilong^ORCID,Chen Xiangrong^ORCID,Dai Chao,Paramane Ashish^ORCID,Awais Muhammad^ORCID,Ren Na^ORCID

Funder

National Natural Science Foundation of China

Key Project of Natural Science Foundation of Zhejiang Province

One-Hundred Talents Program of Zhejiang University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9683991/09641842.pdf?arnumber=9641842

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