A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging-Reference-Cited by-同舟云学术

A Review of Insulation Challenges and Mitigation Strategies in (U)WBG Power Modules Packaging

Published:2024-02-12 Issue: Volume: Page:
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Container-title:2024 IEEE Texas Power and Energy Conference (TPEC)
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Author:

Adhikari Pujan¹,Ghassemi Mona¹

Affiliation:

1. The University of Texas at Dallas,Zero Emission, Realization of Optimized Energy Systems (ZEROES) Laboratory,Department of Electrical and Computer Engineering,Richardson,TX,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10471904/10471906/10472278.pdf?arnumber=10472278

Reference45 articles.

1. A Tutorial on High Density Power Module Packaging

2. Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

3. A Finite Element Analysis Model for Partial Discharges in Silicone Gel under a High Slew Rate, High-Frequency Square Wave Voltage in Low-Pressure Conditions

4. Electric-Field-Dominated Partial Discharge in Medium Voltage SiC Power Module Packaging: Model, Mechanism, Reshaping, and Assessment

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Partial Discharge Inception in Ceramic Substrates Embedded in Silicone Liquid, Silicone Gel, and Mineral Oil at Fast Voltage Rise and Sinusoidal Voltage;IEEE Transactions on Dielectrics and Electrical Insulation;2024-08

2. Characterizing Nonlinear Field Dependent Conductivity Layers to Mitigate Electric Field Within (U)WBG Power Modules Under High Frequency, High Slew Rate Square Voltage Pulses;2024 IEEE Texas Power and Energy Conference (TPEC);2024-02-12