Author:
Kisiel Ryszard,Spiewak Piotr,Kruszewski Miroslaw J.
Cited by
3 articles.
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1. Thermoelectrical Parameters of SiC PiN Diodes with New Die Attachment Ag Paste;2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME);2023-10-18
2. Die attachment Process Overview for High Power Semiconductors;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
3. Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11