Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles-Reference-Cited by-同舟云学术

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Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 45th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Mysliwiec Marcin¹,Kisiel Ryszard²,Pavlov Krystian¹,Kruszewski Miroslaw J.³

Affiliation:

1. Warsaw University of Technology,Centre of Advanced Materials and Technologies,Warsaw,Poland

2. Institute of Microelectronics and Optoelectronics, Warsaw University of Technology,Warsaw,Poland

3. Warsaw University of Technology,Faculty of Materials Science and Engineering,Warsaw,Poland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812830.pdf?arnumber=9812830

Reference16 articles.

1. Effect Of Nickel, Silver And Gold Wafer Backside Metallizations (BSM) On 80Au20Sn (Gold-Tin) Die Attach

2. Highly Reliable Die-Attach Silver Joint with Pressure-Less Sintering Process

3. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

4. Thermomechanical Stress and Strain Distribution and Thermal Resistivity Correlation to Bondline Thickness of Ag Sinter

5. Pressureless and low temperature direct bonding on Si, SiC and GaN via Ag paste sinter-joining

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pressureless sintering performance enhancement of Ag pastes by surface modification of Ag nanoparticles with tert-dodecyl mercaptan;Journal of Nanoparticle Research;2022-10-20

2. Influence of Ag particle shape on mechanical and thermal properties of TIM joints;Microelectronics International;2022-10-13

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