Thermomechanical Stress and Strain Distribution and Thermal Resistivity Correlation to Bondline Thickness of Ag Sinter-Reference-Cited by-同舟云学术

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Thermomechanical Stress and Strain Distribution and Thermal Resistivity Correlation to Bondline Thickness of Ag Sinter

Published:2020-12-02 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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Author:

Villacarlos Bobby Johns L.,Pulutan Marty Lorgino D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9314953/9314863/09315142.pdf?arnumber=9315142

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Chip Size and Shape on the Thermal Stress and Strain of Sintered Ag Joints During Thermal Cycling;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Die attachment Process Overview for High Power Semiconductors;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

3. Diebond Process Optimization and Surface Characterization to Eliminate Conductive Die Attach Film to Ag Plated Pad Delamination due to Intrinsic High Aspect Ratio Ultrathin Die Warpage and Bow Level;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

4. Study on layer formation behavior of Ag joints sintered with pressureless sintering process;Materials Research Express;2022-11-01

5. Influence of Ag particle shape on mechanical and thermal properties of TIM joints;Microelectronics International;2022-10-13

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