Thermal-Aware Modeling and Analysis of Cu-Mixed CNT Nanocomposite Interconnects
Author:
Affiliation:
1. Department of Electronics and Communication Engineering, Indian Institute of Technology (Indian School of Mines), Dhanbad, Jharkhand, India
2. Department of Electrical Engineering, Indian Instituteof Technology Ropar, Rupnagar, Punjab, India
Funder
Department of Electronics Engineering, IIT
DST
Technology Innovation Hub at II
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Science Applications
Link
http://xplorestaging.ieee.org/ielx7/7729/9682520/09739872.pdf?arnumber=9739872
Reference35 articles.
1. Thermal conductivity of single-walled carbon nanotubes
2. Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study
3. Thermal resistance of the native interface between vertically aligned multiwalled carbon nanotube arrays and their SiO2/Si substrate
4. Thermal contact resistance across a copper-silicon interface
5. Electromigration—A brief survey and some recent results
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