Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study-Reference-Cited by-同舟云学术

Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

Published:2018-09 Issue:9 Volume:65 Page:3884-3892
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Lee Jaehyun¹,Berrada Salim¹,Adamu-Lema Fikru¹,Nagy Nicole²,Georgiev Vihar P.¹,Sadi Toufik³,Liang Jie⁴,Ramos Raphael⁵,Carrillo-Nunez Hamilton¹,Kalita Dipankar⁶,Lilienthal Katharina²,Wislicenus Marcus²,Pandey Reeturaj⁴,Chen Bingan⁷,Teo Kenneth B. K.⁷,Goncalves Goncalo⁷,Okuno Hanako⁶,Uhlig Benjamin²,Todri-Sanial Aida⁴,Dijon Jean⁵,Asenov Asen¹

Affiliation:

1. School of Engineering, University of Glasgow, Glasgow, U.K.

2. Center Nanoelectronic Technologies Department, Fraunhofer Institute for Photonic Microsystems, Dresden, Germany

3. Department of Neuroscience and Biomedical Engineering, Aalto University, Aalto, Finland

4. Microelectronics Department, CNRS-LIRMM, Montpellier, France

5. Nanomaterials Department, CEA-LITEN, University of Grenoble Alpes, Grenoble, France

6. Nanomaterials Department, CEA-INAC, University of Grenoble Alpes, Grenoble, France

7. Nanoinstruments Department, AIXTRON Ltd., Cambridge, U.K.

Funder

European Commission

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/8440584/08417905.pdf?arnumber=8417905

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