Optimal segmentation of Cu–CNT interconnects
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s41939-024-00427-1.pdf
Reference43 articles.
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2. Ceyhan A, Naeemi A (2013) Cu interconnect limitations and opportunities for SWNT interconnects at the end of the roadmap. IEEE Trans Electron Devices 60:374–382. https://doi.org/10.1109/TED.2012.2224663
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4. Chai Y, Chan PCH, Fu Y, Chuang YC, Liu CY (2008b) Electromigration studies of Cu/carbon nanotube composite interconnects using blech structure. IEEE Electron Device Lett 29:1001–1003. https://doi.org/10.1109/LED.2008.2002075
5. Cheng ZH, Zhao WS, Dong L, Wang J, Zhao P, Gao H, Wang G (2017) Investigation of copper–carbon nanotube composites as global VLSI interconnects. IEEE Trans Nanotechnol 16:891–900. https://doi.org/10.1109/TNANO.2017.2756928
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