Copper/carbon nanotube composite interconnect for enhanced electromigration resistance-Reference-Cited by-同舟云学术

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Copper/carbon nanotube composite interconnect for enhanced electromigration resistance

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Author:

Yang Chai ,Chan Philip C. H.,Yunyi Fu ,Chuang Y. C.,Liu C. Y.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550004.pdf?arnumber=4550004

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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