Comparison of modeling approaches for transistor degradation: model card adaptations vs subcircuits

Author:

Lange Andre1,Gonzalez Fabio A. Velarde1,Lahbib Insaf2,Crocoll Sonja3

Affiliation:

1. Fraunhofer Institute for Integrated Circuits IIS,Division Engineering of Adaptive Systems EAS,Dresden,Germany

2. X-FAB France SAS,Corbeil-Essonnes Cedex,France

3. X-FAB Dresden GmbH & Co. KG,Dresden,Germany

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reliability improvement of SRAM PUFs based on a detailed experimental study into the stochastic effects of aging;AEU - International Journal of Electronics and Communications;2024-03

2. Aging Modeling and Simulation of the Gate Switching Instability Degradation in SiC MOSFETs;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25

3. A general approach for degradation modeling to enable a widespread use of aging simulations in IC design;Microelectronics Reliability;2022-10

4. On the use of an RTN simulator to explore the quality trade-offs of a novel RTN-based PUF;2022 18th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD);2022-06-12

5. On the Interpolation from Transistor Figures of Merit to Compact Model Parameters;IFAC-PapersOnLine;2022

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