3D IC Partitioning Approach for Achieving Lower TSV Count and Reduced Heat Dissipation using Particle Swarm Optimization
Author:
Affiliation:
1. Sonarpur Mahavidyalaya,Department of Computer Science,Sonarpur, Kolkata,West Bengal,India
2. Ramakrishna Mission Residential College,Department of Computer Science,Narendrapur, Kolkata,West Bengal,India
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9768398/9768400/09768552.pdf?arnumber=9768552
Reference15 articles.
1. Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement
2. A Graph-Based 3D IC Partitioning Technique
3. A thermal aware 3D IC partitioning technique
4. A fast force-directed simulated annealing for 3D IC partitioning;tabrizi;Integration,2016
5. Comparison of PSO, GAs and Analytical Techniques in Second-Order Design of Deformation Monitoring Networks
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1. Genetic Algorithm Based 3D IC Partitioning Approach for TSV Minimization and Efficient Layer Assignment;IETE Journal of Research;2024-01-02
2. An efficient 3D IC partitioning approach using satin bowerbird optimization for reduced TSV count and improved heat dissipation;Engineering Research Express;2023-11-14
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