Foundry Perspectives on 2.5D/3D Integration and Roadmap
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan, R.O.C.,300-091
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720568.pdf?arnumber=9720568
Reference16 articles.
1. InFO (Wafer Level Integrated Fan-Out) Technology
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