Integrated Optical Interconnect Systems (iOIS) for Silicon Photonics Applications in HPC-Reference-Cited by-同舟云学术

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Integrated Optical Interconnect Systems (iOIS) for Silicon Photonics Applications in HPC

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Hsia Harry¹,Tai S. P.¹,Liu C. S.¹,Tseng C. W.¹,Lu S.W.¹,Wu Yutung¹,Chang C. C.¹,Wu Jason¹,Yee K. C.¹,Wu C. Y.¹,Tung C. H.¹,Yu Douglas C.H.¹

Affiliation:

1. TSMC

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195595.pdf?arnumber=10195595

Reference6 articles.

1. Heterogeneous Integration of a Compact Universal Photonic Engine for Silicon Photonics Applications in HPC

2. System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

3. A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing

4. InFO_oS (Integrated Fan-Out on Substrate) Technology for Advanced Chiplet Integration

5. Silicon Photonic 2.5D Multi-Chip Module Transceiver for High-Performance Data Centers

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. 3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Co-packaged Optics;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

4. Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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